Detect different wire bond deformation defects with VTEP
Kwan Wee Lee 2022.08.17
There are different types of wire deformations defects in an IC. Using electrical test methods, automated test equipment (ATE) can capture some of the defect types while others require different test
7 min read
IC Wire Bond Deformation Detection
Kwan Wee Lee 2022.06.27
My previous post on Detecting Near Short Defects in IC Wire Bonds with VTEP Technology shares the concept of detecting wire bond deformations of an IC using Keysight VTEP technology. The technique dep
5 min read
Detecting Near Short Defects in IC Wire Bonds with VTEP Technology
Kwan Wee Lee 2022.06.01
For decades, the semiconductor industry has been struggling with near short defects in the wire bond of an integrated circuit (IC), without an effective solution to detect it. When two wire bonds come
6 min read
5G Beamforming: How to Test Complex Beamformer ICs
Jessy Cavazos 2019.05.31
Multiple input multiple output (MIMO) and beamforming are essential technologies to achieve IMT-2020 vision goals for 5G. They increase capacity and coverage in a cell to enable 100x faster data rates
5 min read